How to Delid

Preparing the PS3 Delid Tool

Shaping the Blade

  1. Place the PS3 Delid Tool on a flat, stable surface with the grip facing up.
  2. Gently lift the handle of the blade, keeping the blade flat on the surface.
  3. Raise the handle until it forms a 90-degree angle.
  4. The blade should naturally curve between 80 to 90 degrees. 

DO NOT bend the blade in the opposite direction, as this may cause it to weaken and break.

Preparing the Motherboard for Delidding

  1. Disassemble the console until only the motherboard remains.
  2. Use isopropyl alcohol and a cotton swab to clean off any excess thermal paste.

At this point, you can choose between two methods: Cold Delid or Warm Delid.

Cold Delid Method:

  1. Carefully insert your PS3 Delid Tool into the gap on the correct side of the Cell Processor’s IHS (Integrated Heat Spreader). This side has a visible gap in the silicone and is located at the bottom of the square, corresponding to the lower edge of the text on the processor.
  2. Brace the motherboard with one hand, and with the other, gently pull the tool upwards so the blade is applying pressure to the underside of the IHS, and then cut towards the first corner of the IHS. Be sure to lift slightly as you pull to ensure you're cutting the silicone as far from the substrate as possible.
  3. Apply moderate force as you continue cutting the silicone towards the corner.
  4. Once you reach the corner, rotate the motherboard and repeat the process on the next side.
  5. Gently finish the delid once all corners have been cut.

Warm Delid Method

  1. Disassemble the console until only the motherboard remains.
  2. Use isopropyl alcohol and a cotton swab to clean off any excess thermal paste.
  3. Apply a small amount of heat to the IHS (Integrated Heat Spreader) using a heat gun or similar tool. The goal is to warm the silicone slightly, making it easier to cut. Do not overheat the IHS; gentle warming is sufficient.

Once the IHS is slightly heated, follow these steps:

  1. Carefully insert your PS3 Delid Tool into the gap on the correct side of the Cell Processor’s IHS. This side has a visible gap in the silicone and is located at the bottom of the square, corresponding to the lower edge of the text on the processor.
  2. Brace the motherboard with one hand, and with the other, gently pull the tool upwards and towards the corner of the IHS. Be sure to lift slightly as you pull to ensure you're cutting the silicone as far from the substrate as possible.
  3. Apply moderate force as you continue cutting the silicone towards the corner. Thanks to the heat, the force required should be less than with the Cold Delid method.
  4. Once you reach the corner, rotate the motherboard and repeat the process on the next side.
  5. Gently finish the delid once all corners have been cut.